Free Access
Issue |
Microsc. Microanal. Microstruct.
Volume 2, Number 1, February 1991
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Page(s) | 75 - 85 | |
DOI | https://doi.org/10.1051/mmm:019910020107500 |
Microsc. Microanal. Microstruct. 2, 75-85 (1991)
DOI: 10.1051/mmm:019910020107500
LERMAT, URA CNRS N° 1317, ISMRa, Boulevard du Maréchal Juin, 14050 Caen Cedex, France
6837L - Transmission electron microscopy (TEM) (including STEM, HRTEM, etc.).
8105M - Cermets, ceramic and refractory composites.
6835 - Solid surfaces and solid-solid interfaces: Structure and energetics.
6220H - Creep.
Key words
Mechanical properties -- Fiber reinforced composites -- Ceramic matrix composite -- Creep -- High temperature -- Microstructure -- Transmission electron microscopy -- Carbon -- Interphase -- Silicon -- Silicon carbides
© EDP Sciences 1991
DOI: 10.1051/mmm:019910020107500
TEM observations of SiC-SiC materials with a carbon interphase after tests at high temperature
Jean Vicens, Marie-Hélène Rouillon, Pascal Fourvel, François Abbé, Moussa Gomina et Jean-Louis ChermantLERMAT, URA CNRS N° 1317, ISMRa, Boulevard du Maréchal Juin, 14050 Caen Cedex, France
Abstract
A microstructural investigation has been performed by TEM on SiC-SiC materials annealed in air up to 1300° C and after creep experiments under vacuum in the temperature range 1000-1400°C. Microstructural modifications of these composites are discussed with respect to the macroscopic mechanical behaviour of SiC-SiC materials.
Résumé
Une étude microstructurale a été réalisée en MET sur des matériaux SiC-SiC recuits à l'air jusqu'à 1300° C et après essais de fluage sous vide entre 1000-1400° C. Les évolutions microstructurales de ces composites sont discutées en fonction de leur comportement mécanique.
6837L - Transmission electron microscopy (TEM) (including STEM, HRTEM, etc.).
8105M - Cermets, ceramic and refractory composites.
6835 - Solid surfaces and solid-solid interfaces: Structure and energetics.
6220H - Creep.
Key words
Mechanical properties -- Fiber reinforced composites -- Ceramic matrix composite -- Creep -- High temperature -- Microstructure -- Transmission electron microscopy -- Carbon -- Interphase -- Silicon -- Silicon carbides
© EDP Sciences 1991