Free Access
| Issue |
Microsc. Microanal. Microstruct.
Volume 6, Number 4, August 1995
|
|
|---|---|---|
| Page(s) | 393 - 403 | |
| DOI | https://doi.org/10.1051/mmm:1995129 | |
References of Microsc. Microanal. Microstruct. 6 393-403
- Lowenheim F.A., Modern Electroplating (John Wiley & Sons, New York, NY, 1974).
- Yung E.K., Romankiw L.T., Alkire R.C., J. Electrochem. Soc. 136 (1989) 206-215. [CrossRef]
- Stremsdoerfer G., Wang-Li Y., Clechet P., Martin J.R., J. Electrochem. Soc. 137 (1990) 3317- 3318. [CrossRef]
- Stremsdoerfer G., Wang Y., Nguyen D., Clechet P., Martin J.R., J. Electrochem. Soc. 140 (1993) 2022-2028. [CrossRef]
- Queau E., Stremsdoerfer G., Martin J.R., Clechet P., Plating Surf. Finishing 81 (1994) 65-69.
- Osaka T., Takematsu H., J. Electrochem. Soc. 127 (1980) 1021-1029. [CrossRef]
- Stremsdoerfer G., Queau E., Martin J.R., 184th Meeting of Electrochem. (Society, New Orleans, Louisiana, 1993).
- Froment M., Queau E., Martin J.R., Stremsdoerfer G., for J. Electrochem. Soc. (1995) in press.
- Felstein N., Schlesinger M., J. Electrochem. Soc. 121 (1974) 738. [CrossRef]
- Martin J.R., Stremsdoerfer G., Queau E., Krafft J.M., Patent N° 93-13 401 (1993).